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Results 201-210 of 230 (Search time: 0.003 seconds).
| NO | Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date) |
|---|---|
| Low frequency electromagnetic field reduction techniques for the On-Line Electric Vehicle (OLEV) Ahn, Seungyoung; Pak, Jun So; Taigon Song; Lee, Hee Jae; Jung-Gun Byun; Deogsoo Kang; Cheol-Seung Choi; Eunjung Kim; Jiyun Ryu; Mijoo Kim; Yumin Ch; CHUN, YANGBAE; Rim, Chun Taek; Jae-Ha Yim; Cho, Dong-Ho; Kim, Joungho, 2010 IEEE International Symposium on Electromagnetic Compatibility, EMC 2010, pp.625 - 630, IEEE, 2010-07-25 | |
| Impact of PCB design on switching noise and EMI of synchronous DC-DC buck converter Koo, K.; Kim, J.; Kim, M.; Kim, Joungho, 2010 IEEE International Symposium on Electromagnetic Compatibility, EMC 2010, pp.67 - 71, IEEE, 2010-07-25 | |
| Multi-layer Probe Card Design with Signal/Power Integrity for Wafer-level AP Test in LPDDR4 Channel Song, Jinwook; Kim, Joungho; Lee, Eunjung; Kim, Jonghoon; Park, Shinyoung; Park, Jeoung Keun; Park, Jong Hyun; Yoon, Hee Bang; Kim, Il; Nam, Seungki, IEEE International Conference on Signal and Power Integrity (SIPI 2016), pp.547 - 552, Institute of Electrical and Electronics Engineers Inc., 2016-07-27 | |
| Highly-Effective Integrated EMI Shields with Graphene and Nanomagnetic Multilayered Composites Watanabe, Atom O; Jeong, Seung Taek; Kim, Subin; Kim, Youngwoo; Min, Junki; Wong, Denny; Pulugurtha, Markondeya R.; Mullapudi, Ravi; Kim, Joungho; Tummala, Rao R., 66th IEEE Electronic Components and Technology Conference, ECTC 2016, pp.206 - 210, Institute of Electrical and Electronics Engineers Inc., 2016-05 | |
| Extraction of the parameters of the coupling capacitance hysteresis cycle for TSV transient modeling Piersanti, S; Pellegrino, E; De Paulis, F; Orlandi, A; Kim, Joungho; Fan, Jun, 2016 IEEE International Symposium on Electromagnetic Compatibility, EMC 2016, pp.406 - 411, Institute of Electrical and Electronics Engineers Inc., 2016-07 | |
| Power distribution network design and optimization based on frequency dependent target impedance Kim, Youngwoo; Kim, Kiyeong; Cho, Jong-Hyun; Kim, Joungho; Kang, Kibum; Yang, Taisik; Ra, Yun; Paik, Woohyun, IEEE Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2015, pp.89 - 92, Institute of Electrical and Electronics Engineers Inc., 2015-12 | |
| Electrical characteristics analysis and comparison between through silicon via(TSV) and through glass via(TGV) Kim, Jihye; Hwang, Insu; Kim, Youngwoo; Kim, Heegon; Kim, Joungho; Sundaram, Venky; Tummala, Rao, IEEE Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2015, pp.93 - 96, Institute of Electrical and Electronics Engineers Inc., 2015-12 | |
| Safety and reliability verification process of coil module in wireless power transfer system using circuit level sensitivity simulation Kim, Jonghoon; Kim, Jonghoon J; Kim, Hongseok; Song, Chiuk; Song, Jinwook; Cho, Yeonje; Kim, Sukjin; Kong, Sunkyu; Jeong, Seungtaek; Kim, Joungho, IEEE Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2015, pp.144 - 147, Institute of Electrical and Electronics Engineers Inc., 2015-12 | |
| Analysis of high frequency characteristics of power inverter using accurate IGBT model based on datasheet and measurement Shim, Hyunwoo; Kim, Hongseok; Song, Jinwook; Kim, Dong-Hyun; Yoon, Kibum; Kim, Joungho; Kim, In-Myoung; Kim, Young-Il, IEEE Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2015, pp.81 - 84, Institute of Electrical and Electronics Engineers Inc., 2015-12 | |
| Analysis of through glass via (TGV) noise coupling effect to noise figure of 2.4GHz LNA on glass interposer Hwang, Insu; Kim, Jihye; Kim, Youngwoo; Cho, Jong-Hyun; Kim, Joungho; Sundaram, Venky; Tummala, Rao, IEEE Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2015, pp.85 - 88, Institute of Electrical and Electronics Engineers Inc., 2015-12 |