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Results 191-200 of 230 (Search time: 0.006 seconds).
| NO | Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date) |
|---|---|
| Large object detection in cluttered background using boosted Markov chain Monte Carlo Kim, S.; Kim, Joungho; Park, C.; Kweon, In-So, 11th International Conference on Control, Automation, Robotics and Vision, ICARCV 2010, pp.2096 - 2101, ICARCV 2010, 2010-12-07 | |
| Hybrid modeling and analysis of power supply noise effects on analog-to-digital converter considering hierarchical PDNs Bae, B.; Shim, Y.; Lee, W.; Koo, K.; Ahn, W.; Kim, Joungho, 2010 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2010, IEEE, 2010-12-07 | |
| High-Freuquency TSV Failure Analysis Kim, Joohee; Cho, Jonghyun; Jung, Hyunsuk; Pak, Jun So; Yook, Jong-Min; Kim, Joungho; Kim, Jun Chul, 20th Conference on Electrical Performance of Electronic Packaging and Systems, EPEP 2011, 2011-10-24 | |
| A designated clock generation and distribution (DCGD) chip scheme for substrate noise-free 3-D stacked SiP design Lee, W.; Ryu, C.; Cho, J.; Song, E.; Kim, Joungho, 2010 Asia-Pacific Symposium on Electromagnetic Compatibility, APEMC 2010, pp.334 - 337, APEMC 2010, 2010-04-12 | |
| A through-silicon-via to active device noise coupling study for CMOS SOI technology Duan, X.; Gu, X.; Cho, J.; Kim, Joungho, 2011 61st Electronic Components and Technology Conference, ECTC 2011, pp.1791 - 1795, ECTC 2011, 2011-05-31 | |
| Slow wave and dielectric quasi-TEM modes of metal-insulator-semiconductor (MIS) structure through silicon via (TSV) in signal propagation and power delivery in 3D chip package Pak, Jun So; Cho, J.; Kim, J.; Lee, J.; Lee, H.; Park, K.; Kim, Joungho, 60th Electronic Components and Technology Conference, ECTC 2010, pp.667 - 672, ECTC 2010, 2010-06-01 | |
| Design of toroidal current probe embedded in multi-layer printed circuit boards for electrostatic discharge(ESD) detection Sung, H.; Song, E.; Kim, M.; Shim, Y.; Kong, S.; Kwon, J.; Kim, Joungho, 2010 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2010, IEEE, 2010-12-07 | |
| Eye-diagram estimation using equivalent circuit model of coupled microstrip channel on high-speed and wide I/O Channel for 2.5D and 3D IC Choi, Sumin; Kim, Joungho; Kim, Hee-Gon; Jung, Daniel Hyunsuk; Kim, Jonghoon J.; Lim, Jaemin; Lee, Hyunsuk; Cho, Kyungjun, 20th IEEE Workshop on Signal and Power Integrity, SPI 2016, Institute of Electrical and Electronics Engineers Inc., 2016-05-08 | |
| Reduction method of electromagnetic interference in tightly-coupled resonant magnetic field automotive charger with input impedance design Yoon, Kibum; Song, Chiuk; Kim, Hongseok; Cho, Yeonje; Jeong, Seungtaek; Kim, Joungho, 2016 IEEE Wireless Power Transfer Conference, WPTC 2016, Institute of Electrical and Electronics Engineers Inc., 2016-05 | |
| Differential signal via shield with narrow via pitch partial electromagnetic bandgap structure Hwang, C.; Shin, M.; Pak, J.S.; Kim, Joungho, 2010 IEEE International Symposium on Electromagnetic Compatibility, EMC 2010, pp.451 - 454, IEEE, 2010-07-25 |