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Results 11-20 of 28 (Search time: 0.013 seconds).
| NO | Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date) |
|---|---|
| Signal Integrity Analysis of Silicon/Glass/Organic Interposers for 2.5D/3D Interconnects Choi, Sumin; Park, Junyong; Jung, Daniel H.; Kim, Joungho; Kim, Heegon; Kim, Kiyeong, IEEE 67th Electronic Components and Technology Conference (ECTC), pp.2139 - 2144, Electronic Components and Technology Conference 2017, 2017-05-30 | |
| Design and Analysis of Wireless Power Transfer System using Flexible Coil and Shielding Material on Smartwatch Strap Kim, Joungho; Jeong, Seungtaek; Song, Jinwook; Kim, Hongseok; Lee, Seongsoo, IEEE Wireless Power Transfer Conference 2017, IEEE Wireless Power Transfer Conference 2017, 2017-05-11 | |
| Chip-level Wireless Power Transfer Scheme Design for Next Generation Wireless Interconnected Three-Dimensional Integrated Circuits Song, Jinwook; Jung, Seungtaek; Park, Shinyoung; Kim, Jonghoon; Hong, Seokwoo; Kim, Joungho, IEEE Wireless Power Transfer Conference (WPTC), IEEE Wireless Power Transfer Conference 2017, 2017-05-10 | |
| Signal and Power Integrity (SI/PI) Analysis of Heterogeneous Integration Using Embedded Multi-die Interconnect Bridge (EMIB) Technology for High Bandwidth Memory (HBM) Kim, Joungho; Cho, Kyungjun; Lee, Hyunsuk; Park, Gapyeol; Kim, Subin; Son, Kyungjune; Choi, Sumin, 2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS), 2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS), 2017-12-16 | |
| Dual-Directional Near Field Communication Tag Antenna with Effective Magnetic Field Isolation from Wireless Power Transfer System Kim, Joungho; Lee, Seongsoo; Jeong, Seungtaek; Kim, Dong-Hyun; Song, Jinwook; Kim, Hongseok, IEEE Wireless Power Transfer Conference 2017, IEEE Wireless Power Transfer Conference 2017, 2017-05-10 | |
| Eye-Diagram Estimation Methods for Voltage-and Probability-Dependent PAM4 Signal on Stacked Through-Silicon Vias (TSVs) Park, Junyong; Kim, Jonghoon J.; Choi, Sumin; Kim, Youngwoo; Kim, Joungho; Kim, Heegon, IEEE 67th Electronic Components and Technology Conference (ECTC), pp.1724 - 1731, Electronic Components and Technology Conference 2017, 2017-05-30 | |
| Measurement and Comparative Analysis of Shielding Effectiveness of Different Sputtered Materials Kim, Joungho; Song, Kyunghwan; Cho, Yeonje; Kim, Subin; Jeong, Seungtaek, IEEE International Symposium on Electromagnetic Compatibility, IEEE International Symposium on Electromagnetic Compatibility, 2017-08-09 | |
| Design and Verification of a High-Speed Connector for Multi-Media System Kim, Joungho; Song, Huijin; Kim, Jonghoon; Lee, Junho; Choi, Seongmin, IEEE International Symposium on Electromagnetic Compatibility, IEEE International Symposium on Electromagnetic Compatibility, 2017-08-09 | |
| Signal integrity analysis of a super speed pair of a USB 3.0 connector with test Jig Kim, Joungho; Kim, Hyesoo; Park, Shinyoung; Kim, Jonghoon; Park, Jung-Min; Kim, UnHo; Jeon, YuckHwan, 2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS), 2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS), 2017-12-15 | |
| Signal Integrity Analysis of Machine Pressed Coaxial Connector for Automotive System Kim, Joungho; Kim, Dong-Hyun; Lee, Hyunsuk; Kim, Jonghoon; Park, Jung-Min; Kim, Un-ho; Kim, Kun-ho; Jeon, Yeok-Hwan; Kwon, Hyeok-Cheol; Kim, Hoon; Song, Maeng-Ki, IEEE International Conference on Electrical Performance of Electronic Packaging Systems 2017, IEEE International Conference on Electrical Performance of Electronic Packaging Systems 2017, 2017-10-18 |
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