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Results 21-29 of 29 (Search time: 0.005 seconds).
| NO | Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date) |
|---|---|
| Analysis of high frequency characteristics of power inverter using accurate IGBT model based on datasheet and measurement Shim, Hyunwoo; Kim, Hongseok; Song, Jinwook; Kim, Dong-Hyun; Yoon, Kibum; Kim, Joungho; Kim, In-Myoung; Kim, Young-Il, IEEE Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2015, pp.81 - 84, Institute of Electrical and Electronics Engineers Inc., 2015-12 | |
| Analysis of through glass via (TGV) noise coupling effect to noise figure of 2.4GHz LNA on glass interposer Hwang, Insu; Kim, Jihye; Kim, Youngwoo; Cho, Jong-Hyun; Kim, Joungho; Sundaram, Venky; Tummala, Rao, IEEE Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2015, pp.85 - 88, Institute of Electrical and Electronics Engineers Inc., 2015-12 | |
| Analysis of external force dependent lumped RLGC model of high-bandwidth and high-density silicone rubber socket Park, Junyong; Kim, Hyesoo; Kim, Youngwoo; Kim, Jonghoon J; Bae, Bumhee; Kim, Joungho; Ha, Dongho; Bae, Michael, IEEE Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2015, pp.54 - 57, Institute of Electrical and Electronics Engineers Inc., 2015-12 | |
| Design of an on-interposer passive equalizer embedded on a ground plane for 30Gbps serial data transmission Jeon, Yeseul; Kim, Heegon; Choi, Sumin; Song, Jinwook; Kim, Youngwoo; Kim, Joungho, IEEE Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2015, pp.50 - 53, Institute of Electrical and Electronics Engineers Inc., 2015-12 | |
| Modeling and analysis of a conductive rubber contactor for package test Kim, Hyesoo; Bae, Bumhee; Kim, Jonghoon J; Park, Junyong; Ha, Dongho; Bae, Michael; Kim, Joungho, 17th IEEE Electronics Packaging and Technology Conference, EPTC 2015, Institute of Electrical and Electronics Engineers Inc., 2015-12 | |
| A fast statistical eye-diagram estimation method for high-speed channel including non-linear receiver circuit Kim, Hee-Gon; Kim, Kiyeong; Kim, Jingook; Yoon, Changwook; Kim, Hyungsoo; Kim, Jonghoon J; Kim, Joungho, DesignCon 2015, UBM Electronics, 2015-01 | |
| Electromagnetic noise effects on semiconductor system in electric vehicle Bae, Bumhee; Kim, Jonghoon J; Kim, Sukjin; Kong, Sunkyu; Jung, Daniel H; Kim, Joungho, DesignCon 2015, UBM Electronics, 2015-01 | |
| Through silicon via time domain crosstalk modeling considering hysteretic coupling capacitance Piersanti, S; De Paulis, F; Orlandi, A; Kim, Dong-Hyun; Cho, Jong-Hyun; Kim, Joungho, IEEE International Symposium on Electromagnetic Compatibility, EMC 2015, pp.567 - 572, Institute of Electrical and Electronics Engineers Inc., 2015-08 | |
| Active Si interposer for 3D IC integrations Kim, Joungho, International 3D Systems Integration Conference, 3DIC 2015, Institute of Electrical and Electronics Engineers Inc., 2015-08 |
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