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| NO | Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date) |
|---|---|
| Design and analysis of high bandwidth memory (HBM) interposer Considering Signal and Power integirty (SI/PI) for terabyte/s bandwidth system Kim, Joungho; Cho, Kyungjun; Lee, Hyunsuk; Kim, Heegon; Kim, Youngwoo; Choi, Sumin; Kim, Subin; Kim, Hyungsoo, DesignCon 2017, DesignCon 2017, 2017-02-01 | |
| Signal and Power Integrity (SI/PI) Analysis of Heterogeneous Integration Using Embedded Multi-die Interconnect Bridge (EMIB) Technology for High Bandwidth Memory (HBM) Kim, Joungho; Cho, Kyungjun; Lee, Hyunsuk; Park, Gapyeol; Kim, Subin; Son, Kyungjune; Choi, Sumin, 2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS), 2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS), 2017-12-16 |
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