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| NO | Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date) |
|---|---|
| Power and Signal Integrity Analysis of Fan-out Wafer Level Package for Mobile Application Processor Kim, Joungho; Kim, Youngwoo; Cho, Kyungjun; Park, Gapyeol; Kim, Subin; Kang, Kibum; So, Kwangsup; Jeon, Jiwon; Kim, Chungju; Paik, Woohyun, DesignCon 2017, DesignCon 2017, 2017-01-31 | |
| Hierarchical Power Distribution Network Design in Fanout Wafer Level Package based Mobile AP-GPU for Multi-Media System Kim, Joungho; Kim, Youngwoo; Cho, Kyungjun; Park, Gapyeol; Kim, Subin, 2017 Asia-Pacific International Symposium on Electromagnetic Compatibility, 2017 Asia-Pacific International Symposium on Electromagnetic Compatibility, 2017-06-22 | |
| Modeling of Through-silicon Via (TSV) with an hmbedded High-density Metal-insulator-metal (MIM) Capacitor Cho, Kyunjun; Kim, Youngwoo; Kim, Subin; Park, Gapyeol; Son, Kyungjune; Park, Hyunwook; Kim, Seongguk; Choi, Sumin; Kim, Dong-Hyun; Kim, Joungho, IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS), IEEE, 2018-12 | |
| Reinforcement Learning-based Optimal On-board Decoupling Capacitor Design Method Park, Hyunwook; Park, Junyong; Kim, Subin; Lho, Daehwan; Park, Shinyoung; Park, Gapyeol; Cho, Kyungjun; Kim, Joungho, 27th IEEE Conference on Electrical Performance on Electronic Packaging and Systems (EPEPS), pp.213 - 215, IEEE, 2018-10-15 | |
| Modeling and Signal Integrity Analysis of 3D XPoint Memory Cells and Interconnections with Memory Size Variations During Read Operation Son, Kyungjune; Cho, Kyungjun; Kim, Subin; Park, Gapyeol; Song, Kyunghwan; Kim, Joungho, 2018 IEEE Symposium on Electromagnetic Compatibility, Signal & Power Integrity, pp.223 - 227, 2018 IEEE Symposium on Electromagnetic Compatibility, Signal & Power Integrity, 2018-08-01 | |
| Signal and Power Integrity (SI/PI) Analysis of Heterogeneous Integration Using Embedded Multi-die Interconnect Bridge (EMIB) Technology for High Bandwidth Memory (HBM) Kim, Joungho; Cho, Kyungjun; Lee, Hyunsuk; Park, Gapyeol; Kim, Subin; Son, Kyungjune; Choi, Sumin, 2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS), 2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS), 2017-12-16 | |
| Power/ground noise coupling comparison and analysis in silicon, organic and glass interposers Kim, Youngwoo; Cho, Kyungjun; Kim, Subin; Park, Gapyeol; Kim, Joungho, 2016 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2016, pp.11 - 13, Institute of Electrical and Electronics Engineers Inc., 2016-12 | |
| Impact of On-Chip Interconnection in a Large-Scale Memristor Crossbar Array for Neural Network Accelerator and Neuromorphic Chip Shin, TaeIn; Son, Kyungjune; Kim, Seongguk; Cho, Kyungjun; Park, Shinyoung; Kim, Subin; Park, Gapyeol; Sim, Boogyo; Kim, Joungho, 28th IEEE Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2019, Institute of Electrical and Electronics Engineers Inc., 2019-10 |
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