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Results 11-20 of 31 (Search time: 0.006 seconds).
| NO | Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date) |
|---|---|
| Bias-dependent Power Distribution Network Impedance Analysis with MOS Capacitor Kim, Dong-Hyun; Kim, Subin; Park, Junyong; Kim, Youngwoo; Choi, Sumin; Cho, Kyungjun; Kim, Joungho, 2018 Joint Institute of Electrical and Electronics Engineers Eletromagnetic Compatibility (EMC) & Asia-Pacific international symposium on Eletromagnetic Compatibility (APEMC), pp.40 - 40, IEEE EMC & APEMC, 2018-05-16 | |
| Modeling and Signal Integrity Analysis of 3D XPoint Memory Cells and Interconnections with Memory Size Variations During Read Operation Son, Kyungjune; Cho, Kyungjun; Kim, Subin; Park, Gapyeol; Song, Kyunghwan; Kim, Joungho, 2018 IEEE Symposium on Electromagnetic Compatibility, Signal & Power Integrity, pp.223 - 227, 2018 IEEE Symposium on Electromagnetic Compatibility, Signal & Power Integrity, 2018-08-01 | |
| Signal and Power Integrity (SI/PI) Analysis of Heterogeneous Integration Using Embedded Multi-die Interconnect Bridge (EMIB) Technology for High Bandwidth Memory (HBM) Kim, Joungho; Cho, Kyungjun; Lee, Hyunsuk; Park, Gapyeol; Kim, Subin; Son, Kyungjune; Choi, Sumin, 2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS), 2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS), 2017-12-16 | |
| Design and Analysis of Receiver Channels of Glass Interposer for Dual Band Wi-Fi Front End Module (FEM) Kim, Joungho; Park, Gapyeol; Kim, Youngwoo; Cho, Kyungjun; Kim, Minsuk; Pulugurtha Markondeya Raj; Venky Sundaram; Rao Tummala, IEEE International Symposium on Electromagnetic Compatibility, IEEE International Symposium on Electromagnetic Compatibility, 2017-08-09 | |
| Design methodology of passive equalizer for GDDR6 memory test Kim, Subin; Kim, Seongguk; Kim, Hyesoo; Cho, Kyungjun; Kim, Joungho, 2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility, EMC Sapporo/APEMC 2019, pp.270 - 273, Institute of Electrical and Electronics Engineers Inc., 2019-06 | |
| Signal Integrity Design of Bump-less Interconnection for High-speed Signaling in 2.5D and 3D IC Kim, Joungho; Kim, Heegon; Choi, Sumin; Kim, Dong-Hyun; Cho, Kyungjun, 2015 Asia-Pacific International Symposium on Electromagnetic Compatibility (APEMC), 2015 Asia-Pacific International Symposium on Electromagnetic Compatibility (APEMC), 2015-05-26 | |
| Electrical Performance of High Bandwidth Memory (HBM) Interposer Channel in Terabyte/s Bandwidth Graphics Module Kim, Joungho; Cho, Kyungjun; Kim, Heegon; Choi, Sumin; Lim, Jaemin, IEEE International 3D Systems Integration Conference (3DIC), IEEE International 3D Systems Integration Conference (3DIC), 2015-08-31 | |
| A Fast Statistical Eye-diagram Estimation Method including Internal PDN Noise of Pseudo-differential Receiver Buffer Kim, Joungho; Kim, Heegon; Choi, Sumin; Kim, Jonghoon J; Jung, Daniel H; Lee, Hyunuk; Cho, Kyungjun, IEEE Electrical Design of Advanced Packaging & System Symposium, IEEE Electrical Design of Advanced Packaging & System Symposium, 2015-12-15 | |
| Power Distribution Network (PDN) Design and Analysis of A Single and. Double-Sided High Bandwidth Memory (HBM) Interposer for 2.5D Terabtye/s Bandwidth System Cho, Kyungjun; Kim, Joungho; Kim, Youngwoo; Kim, Subin; Lee, Hyunsuk; Choi, Sumin; Kim, Heegon, IEEE International Conference on Signal and Power Integrity (SIPI 2016), IEEE International Conference on Signal and Power Integrity (SIPI 2016), 2016-07-27 | |
| Signal Integrity of Bump-less High-speed Through Silicon Via Channel for Terabyte/s Bandwidth 2.5D IC Lee, Hyunsuk; Kim, Joungho; Kim, Heegon; Choi, Sumin; Lim, Jaemin; Cho, Kyungjun; Jeon, Yeseul, 66th Electronic Components and Technology Conference (ECTC), 66th Electronic Components and Technology Conference (ECTC), 2016-05-31 |