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Showing results 1 to 11 of 11

1
A 100Mb/s Galvanically-Coupled Body-Channel-Communication Transceiver with 4.75pJ/b TX and 26.8 pJ/b RX for Bionic Arms

Jeon, Yeseul; Jung, Chongsoo; Cheon, Song-I; Cho, Hyungjoo; Suh, Ji-Hoon; Jeon, Hyuntak; Koh, Seok-Tae; et al, 33rd Symposium on VLSI Circuits, VLSI Circuits 2019, pp.C292 - C293, Institute of Electrical and Electronics Engineers Inc., 2019-06-13

2
A 3.9 mu W, 81.3dB SNDR, DC-coupled, Time-based Neural Recording IC with Degeneration R-DAC for Bidirectional Neural Interface in 180nm CMOS

Jeon, Hyuntak; Bang, Jun-Suk; Jung, Yoontae; Lee, Taeju; Jeon, Yeseul; Koh, Seok-Tae; Choi, Jaesuk; et al, IEEE Asian Solid-State Circuits Conference (A-SSCC), pp.91 - 92, IEEE, 2018-11

3
A 3.9μW, 81.3dB SNDR, DC-coupled, Time-based Neural Recording IC with Degeneration R-DAC for Bidirectional Neural Interface in 180nm CMOS

Jeon, Hyuntak; Bang, Jun-Suk; Jung, Yoontae; Lee, Taeju; Jeon, Yeseul; Koh, Seok-Tae; Choi, Jaeseok; et al, IEEE Asian Solid-State Circuits Conference, IEEE, 2018-11-07

4
A 650-uW 30-Mbps Galvanic Coupling Communication Receiver for Bionic Arms

Jeon, Yeseul; Jeon, Hyuntak; Cheon, Song-I; Jung, Chongsoo; Je, Minkyu, IEEE International Symposium on Circuits and Systems, IEEE, 2018-05-28

5
A Batteryless Electrochemical Sensing System IC Based on Intra-Body Power and Data Transfer Towards Miniaturized Wearable Sensor Nodes

Suh, Ji-Hoon; Cho, Hyungjoo; Jeon, Yeseul; Je, Minkyu, 2023 IEEE International Symposium on Circuits and Systems (ISCAS), IEEE, 2023-05-21

6
An Area-Efficient Rectifier with Threshold Voltage Cancellation for Intra-Body Power Transfer

Cho, Hyungjoo; Suh, Ji-Hoon; Shin, Hongseok; Jeon, Yeseul; Jung, Chongsoo; Je, Minkyu, 2019 IEEE International Symposium on Circuits and Systems, ISCAS 2019, Institute of Electrical and Electronics Engineers Inc., 2019-05-28

7
Analysis of Vertical PCB Connector Induced Via Stub Reduction in High Speed Serial Link

Kim, Dong-Hyun; Kim, Joungho; Kim, Heegon; Lim, Jaemin; Jeon, Yeseul; Koh, Wee Jin; Chang, Weng Yew Richard, Asia-Pacific International Symposium on Electromagnetic Compatibility & Signal Integrity and Technical Exhibition (APEMC 2016), Asia-Pacific International Symposium on Electromagnetic Compatibility & Signal Integrity and Technical Exhibition (APEMC 2016), 2016-05-19

8
Analysis on Via Design for Impedance Mismatch Minimization in High Speed Channel

Lim, Jaemin; Kim, Joungho; Kim, Heegon; Kim, Dong-Hyun; Jeon, Yeseul; Koh, Wee Jin; Chang Weng Yew Richard, Asia-Pacific International Symposium on Electromagnetic Compatibility & Signal Integrity and Technical Exhibition (APEMC 2016), Asia-Pacific International Symposium on Electromagnetic Compatibility & Signal Integrity and Technical Exhibition (APEMC 2016), 2016-05-19

9
Design of an on-interposer passive equalizer embedded on a ground plane for 30Gbps serial data transmission

Jeon, Yeseul; Kim, Heegon; Choi, Sumin; Song, Jinwook; Kim, Youngwoo; Kim, Joungho, IEEE Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2015, pp.50 - 53, Institute of Electrical and Electronics Engineers Inc., 2015-12

10
Design of an On-interposer Passive Equalizer for High Bandwidth Memory (HBM) with 30Gbps Data Transmission

Jeon, Yeseul; Kim, Joungho; Kim, Heegon; Choi, Sumin; Kim, Youngwoo, 66th Electronic Components and Technology Conference (ECTC), 66th Electronic Components and Technology Conference (ECTC), 2016-05-31

11
Signal Integrity of Bump-less High-speed Through Silicon Via Channel for Terabyte/s Bandwidth 2.5D IC

Lee, Hyunsuk; Kim, Joungho; Kim, Heegon; Choi, Sumin; Lim, Jaemin; Cho, Kyungjun; Jeon, Yeseul, 66th Electronic Components and Technology Conference (ECTC), 66th Electronic Components and Technology Conference (ECTC), 2016-05-31

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