학위논문(박사) - 한국과학기술원 : 기계공학전공, 2002.8, [ x, 107 p. ]
계면파괴역학; 신뢰성; 다층 구조; 전자 패키지; 열응력; thermal stress; interfacial fracture mechanics; reliability; multi-layered structure; electronic packages
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