전자 패키지에서 다층 구조의 기계적인 신뢰성에 관한 연구A study on mechanical reliability of multi- layered structure in electronic packages
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.advisor | 엄윤용 | - |
| dc.contributor.advisor | Earmme, Youn-Young | - |
| dc.contributor.author | 김재현 | - |
| dc.contributor.author | Kim, Jae-Hyun | - |
| dc.date.accessioned | 2011-12-14T05:20:03Z | - |
| dc.date.available | 2011-12-14T05:20:03Z | - |
| dc.date.issued | 2002 | - |
| dc.identifier.uri | http://library.kaist.ac.kr/search/detail/view.do?bibCtrlNo=177247&flag=dissertation | - |
| dc.identifier.uri | http://hdl.handle.net/10203/43146 | - |
| dc.description | 학위논문(박사) - 한국과학기술원 : 기계공학전공, 2002.8, [ x, 107 p. ] | - |
| dc.language | kor | - |
| dc.publisher | 한국과학기술원 | - |
| dc.subject | 계면파괴역학 | - |
| dc.subject | 신뢰성 | - |
| dc.subject | 다층 구조 | - |
| dc.subject | 전자 패키지 | - |
| dc.subject | 열응력 | - |
| dc.subject | thermal stress | - |
| dc.subject | interfacial fracture mechanics | - |
| dc.subject | reliability | - |
| dc.subject | multi-layered structure | - |
| dc.subject | electronic packages | - |
| dc.title | 전자 패키지에서 다층 구조의 기계적인 신뢰성에 관한 연구 | - |
| dc.title.alternative | A study on mechanical reliability of multi- layered structure in electronic packages | - |
| dc.type | Thesis(Ph.D) | - |
| dc.identifier.CNRN | 177247/325007 | - |
| dc.description.department | 한국과학기술원 : 기계공학전공, | - |
| dc.identifier.uid | 000965096 | - |
| dc.contributor.localauthor | 엄윤용 | - |
| dc.contributor.localauthor | Earmme, Youn-Young | - |
- Appears in Collection
- ME-Theses_Ph.D.(박사논문)
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