(A) two-axis actuated electrostatic micromirror for 3-D optical crossconnect

Abstract

A new MEMS micromirror structure has been designed and fabricated for 3-D optical crossconnect. By analytic calculation and simulations, the actuation angles of the proposed micromirror have been estimated. The device has been fabricated by electroplating Cu using photoresist as a mold. To make a five layer mirror structure, double MESD ( Multi Expose Single Development ) has been used. The MESD process is the proprietary MEMS process developed at KAIST semiconductor research laboratory. Polishing has been added at the end of process to enhance the surface flatness and roughness of the fabricated micromirrors. The fabricated mirror structure has been characterized with a 3-D profiler and AFM to measure the actuation angle and surface roughness. Surface flatness of 0.88㎛ and roughness of 120Å have been acquired, respectively. Maximum actuation angle of 2.65° at 244 V has been measured.