High frequency modeling of multiple line grid array (MLGA) package and embedded passives

Abstract

In this paper, we introduce the MLGA package and its electrical equivalent circuit model, and the equivalent circuit model parameters are extracted by measurement. Further more, this paper discusses the design and the estimation of the embedded passives, such as multi-layer parallel plate capacitor and a spiral inductor in the MLG. According to the simulation result using Finite Element Method (FEM), the capacitance value of the embedded capacitor ranges from 7pF to 170pF when glass ceramic, which has 7.8 of dielectric constant, is used. And three types of inductors are suggested as possible embedded inductor structures and compared with their electrical characteristics. The effects of the decoupling capacitor using the embedded passives in the MLG is simulated and demonstrated to be quite useful suppressing the simultaneous switching noise and noise filtering.