Scalable modeling of a through silicon via (TSV) channel & proposal of the TSV equalizers in 3D IC

Abstract

3-dimensional Integrated Circuit (3D IC) is a 3-dimensional integration of the homo or heterogeneous chips such as memory, logic, RF, analog and sensors. It realizes highly dense packaging and high performance due to smaller form factor and reduced interconnect length by vertical integration. As one of the key technology to provide vertical interconnection method, Through Silicon Via (TSV) enables to 3-dimensionally integrate the system. By using structural dimensions of a TSV structure, the scalable model which can be expanded with structural or dimensional change is proposed and verified by measurement. In addition, with the proposed scalable model, we analyzed the electrical characteristics of TSV channel depending on design parameters. With the analysis of the TSV channel, we proposed novel TSV Equalizer which can compensate the frequency dependent loss of a TSV for high speed signal transmission.