Design and analysis of low-noise and low-power system-in-package (SiP) for Non-coherent Ultra Wide-Band (UWB) transceiver based on system model consisting of chip-package-PCB

Abstract

System-in-Package (SiP) technology has been a promising solution to a system minimization with an integration of all components which a system function needs. Also, Ultra Wide-Band (UWB) System has been emerging as a promising wireless application for a high-speed data transmission, low-power consumption and low design complexity in Wireless Personal Area Network (WPAN) in these days. Due to a very different frequency range from single frequency in RF circuit to wide and multiple frequencies in digital circuit and a difference in physical dimension from a chip-scaled micro-meter to a few centimeters order in board level, a mixed UWB transceiver SiP is getting harder to be working successfully at a one time. In order to enhance a system yield and increase a success-rate of system function, this paper introduces a co-design method at three different system classes of chip, package and board. The co-design method consists of various different modelling methods such as a mathematical model, behaviour model, matrix model, spice model and functional code model. With these models, it is possible to analyze noise effect on UWB system before the system fabrication. Key word: Ultra Wide-Band (UWB), System-in-Package (SiP), Co-design method