학위논문(석사) - 한국과학기술원 : 신소재공학과, 2024.2,[v, 48 p. :]
구리-구리 접합▼a3D-IC▼a금속 보호층▼a루테늄▼a접합 메커니즘; Cu-Cu bonding▼a3D-IC▼aMetal passivation▼aRuthenium▼aBonding mechanism
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