Dual responsive materials for sequential patterning by thermal imprint and photolithography

Abstract

Curing imprint lithography (UV or thermal) has emerged as a less expensive alternative to print nano-scale features. But typical imprint resists is difficult to degrade because of highly cross-linking. By designing a resist in which all of the cross-linkers are cleavable under mild acid conditions, we would require only a simple degradation step to remove the film after imprinting. In this study, methacylate monomers containing tertiary ester linkages and hydroxyl groups were copolymerized with diazoketo-functionalized monomers, and then polymers were coated on substrate with a photoacid generator. Polymers were patterned with thermal imprint lithography to create cross-linked films through hydroxyl-diazoketo linkages. Films could be Sequential patterned in a subsequent photolithography step by thermal and acid-catalyzed decomposition of tertiary ester linkages. We introduce the combination of thermal imprint and photolithography into a single system.