Enhancing Predictability of Thermal Warpage of Molded Wafer by Applying Accurate Thermo-Mechanical Properties of Epoxy Molding Compound
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Kim, Junmo | ko |
| dc.contributor.author | Song, Myoung | ko |
| dc.contributor.author | Gu, Chang-Yeon | ko |
| dc.contributor.author | Ma, Sung Woo | ko |
| dc.contributor.author | Jeong, Mu-Hyeon | ko |
| dc.contributor.author | Lee, Jin Hee | ko |
| dc.contributor.author | Lee, Woong-Sun | ko |
| dc.contributor.author | Kim, Taek-Soo | ko |
| dc.date.accessioned | 2024-01-05T02:03:38Z | - |
| dc.date.available | 2024-01-05T02:03:38Z | - |
| dc.date.created | 2024-01-02 | - |
| dc.date.issued | 2023-03-08 | - |
| dc.identifier.citation | The 7th IEEE Electron Devices Technology and Manufacturing (EDTM) Conference 2023 | - |
| dc.identifier.uri | http://hdl.handle.net/10203/317425 | - |
| dc.language | English | - |
| dc.publisher | IEEE | - |
| dc.title | Enhancing Predictability of Thermal Warpage of Molded Wafer by Applying Accurate Thermo-Mechanical Properties of Epoxy Molding Compound | - |
| dc.type | Conference | - |
| dc.type.rims | CONF | - |
| dc.citation.publicationname | The 7th IEEE Electron Devices Technology and Manufacturing (EDTM) Conference 2023 | - |
| dc.identifier.conferencecountry | KO | - |
| dc.identifier.conferencelocation | COEX, Seoul | - |
| dc.contributor.localauthor | Kim, Taek-Soo | - |
| dc.contributor.nonIdAuthor | Ma, Sung Woo | - |
| dc.contributor.nonIdAuthor | Jeong, Mu-Hyeon | - |
| dc.contributor.nonIdAuthor | Lee, Jin Hee | - |
| dc.contributor.nonIdAuthor | Lee, Woong-Sun | - |
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