Elucidating the Mechanical Properties of Transparent Conductive Thin Films for Mechanically Reliable Microelectronics
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Oh, Seung Jin | ko |
| dc.contributor.author | Choi, Kyung Cheol | ko |
| dc.contributor.author | Kwon, Jeong Hyun | ko |
| dc.contributor.author | Kim, Taek-Soo | ko |
| dc.date.accessioned | 2024-01-04T01:01:56Z | - |
| dc.date.available | 2024-01-04T01:01:56Z | - |
| dc.date.created | 2024-01-02 | - |
| dc.date.issued | 2023-10-27 | - |
| dc.identifier.citation | The 21st International Symposium on Microelectronics and Packaging (ISMP) | - |
| dc.identifier.uri | http://hdl.handle.net/10203/317324 | - |
| dc.language | English | - |
| dc.publisher | The Korean Microelectronics and Packaging Society | - |
| dc.title | Elucidating the Mechanical Properties of Transparent Conductive Thin Films for Mechanically Reliable Microelectronics | - |
| dc.type | Conference | - |
| dc.type.rims | CONF | - |
| dc.citation.publicationname | The 21st International Symposium on Microelectronics and Packaging (ISMP) | - |
| dc.identifier.conferencecountry | KO | - |
| dc.identifier.conferencelocation | Paradise Hotel Busan | - |
| dc.contributor.localauthor | Choi, Kyung Cheol | - |
| dc.contributor.localauthor | Kim, Taek-Soo | - |
| dc.contributor.nonIdAuthor | Kwon, Jeong Hyun | - |
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