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College of Engineering(공과대학)Dept. of Materials Science and Engineering(신소재공학과)MS-Conference Papers(학술회의논문)

Plasma-Assisted CMP for Planarization of Adhesive Polymers in 3D Stacked Semiconductor Devices

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dc.contributor.authorKang, Sukkyungko
dc.contributor.authorPark, Juseongko
dc.contributor.authorJeon, Chan Suko
dc.contributor.authorKim, Kyung Minko
dc.contributor.authorKim, Sanhako
dc.date.accessioned2024-01-03T11:00:55Z-
dc.date.available2024-01-03T11:00:55Z-
dc.date.created2023-12-30-
dc.date.issued2023-11-01-
dc.identifier.citationInternational Conference on Planarization/CMP Technology, ICPT 2023-
dc.identifier.urihttp://hdl.handle.net/10203/317315-
dc.languageEnglish-
dc.publisherInternational Conference on Planarization Technology (ICPT)-
dc.titlePlasma-Assisted CMP for Planarization of Adhesive Polymers in 3D Stacked Semiconductor Devices-
dc.typeConference-
dc.type.rimsCONF-
dc.citation.publicationnameInternational Conference on Planarization/CMP Technology, ICPT 2023-
dc.identifier.conferencecountryJA-
dc.identifier.conferencelocationKanazawa-
dc.contributor.localauthorKim, Kyung Min-
dc.contributor.localauthorKim, Sanha-
dc.contributor.nonIdAuthorJeon, Chan Su-
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MS-Conference Papers(학술회의논문)ME-Conference Papers(학술회의논문)
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