Investigation of Copper-Ruthenium Diffusion Behavior in Ruthenium Passivated Copper Direct Bonding
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Kim, Myeongeun | ko |
| dc.contributor.author | Kang, Sukkyung | ko |
| dc.contributor.author | Kim, Sanha | ko |
| dc.contributor.author | Kim, Kyung Min | ko |
| dc.date.accessioned | 2024-01-03T09:01:07Z | - |
| dc.date.available | 2024-01-03T09:01:07Z | - |
| dc.date.created | 2023-12-30 | - |
| dc.date.issued | 2023-11-02 | - |
| dc.identifier.citation | The 7th International Conference on Advanced Electromaterials, ICAE 2023 | - |
| dc.identifier.uri | http://hdl.handle.net/10203/317297 | - |
| dc.language | English | - |
| dc.publisher | International Conference on Advanced Electromaterials(ICAE) | - |
| dc.title | Investigation of Copper-Ruthenium Diffusion Behavior in Ruthenium Passivated Copper Direct Bonding | - |
| dc.type | Conference | - |
| dc.type.rims | CONF | - |
| dc.citation.publicationname | The 7th International Conference on Advanced Electromaterials, ICAE 2023 | - |
| dc.identifier.conferencecountry | KO | - |
| dc.identifier.conferencelocation | Ramada Plaza Jeju Hotel | - |
| dc.contributor.localauthor | Kim, Sanha | - |
| dc.contributor.localauthor | Kim, Kyung Min | - |
| dc.contributor.nonIdAuthor | Kim, Myeongeun | - |
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