DC Field | Value | Language |
---|---|---|
dc.contributor.author | Ki, Seokgan | ko |
dc.contributor.author | Nam, Youngsuk | ko |
dc.date.accessioned | 2023-12-20T07:01:20Z | - |
dc.date.available | 2023-12-20T07:01:20Z | - |
dc.date.created | 2023-11-30 | - |
dc.date.issued | 2023-03-08 | - |
dc.identifier.citation | IEEE Electron Devices Technology and Manufacturing Conference 2023 | - |
dc.identifier.uri | http://hdl.handle.net/10203/316727 | - |
dc.language | English | - |
dc.publisher | IEEE Electron Devices Society | - |
dc.title | Thermal Packaging Utilizing Gallium-Based Liquid Metals | - |
dc.type | Conference | - |
dc.type.rims | CONF | - |
dc.citation.publicationname | IEEE Electron Devices Technology and Manufacturing Conference 2023 | - |
dc.identifier.conferencecountry | KO | - |
dc.identifier.conferencelocation | COEX, Seoul | - |
dc.contributor.localauthor | Nam, Youngsuk | - |
dc.contributor.nonIdAuthor | Ki, Seokgan | - |
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