Silicon wafer thickness measurement based on optical third-harmonic generation with femtosecond laser pulses

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dc.contributor.authorLee, In Jaeko
dc.contributor.authorKim, Dae Heeko
dc.contributor.authorHahm, Ji Wonko
dc.contributor.authorKIM, Young-Jinko
dc.contributor.authorKim, Seung-Wooko
dc.date.accessioned2023-12-18T08:02:01Z-
dc.date.available2023-12-18T08:02:01Z-
dc.date.created2023-11-24-
dc.date.issued2023-04-21-
dc.identifier.citationThe 12th Advanced Lasers and Photon Sources-
dc.identifier.urihttp://hdl.handle.net/10203/316648-
dc.languageEnglish-
dc.publisherALPS 2023-
dc.titleSilicon wafer thickness measurement based on optical third-harmonic generation with femtosecond laser pulses-
dc.typeConference-
dc.type.rimsCONF-
dc.citation.publicationnameThe 12th Advanced Lasers and Photon Sources-
dc.identifier.conferencecountryJA-
dc.identifier.conferencelocationPACIFICO Yokohama-
dc.contributor.localauthorKIM, Young-Jin-
dc.contributor.localauthorKim, Seung-Woo-
dc.contributor.nonIdAuthorLee, In Jae-
dc.contributor.nonIdAuthorKim, Dae Hee-
dc.contributor.nonIdAuthorHahm, Ji Won-
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ME-Conference Papers(학술회의논문)
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