Silicon Wafer’s Non-destructive Measurement System based on Optical Third Harmonic Generation (THG)

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dc.contributor.authorLee, In Jaeko
dc.contributor.authorKim, Dae Heeko
dc.contributor.authorHahm, Jiwonko
dc.contributor.authorKIM, Young-Jinko
dc.contributor.authorKim, Seung-Wooko
dc.date.accessioned2023-12-13T06:01:21Z-
dc.date.available2023-12-13T06:01:21Z-
dc.date.created2023-11-24-
dc.date.issued2023-05-16-
dc.identifier.citationThe 18th IEEE International Conference on Nano/Micro Engineered and Molecular Systems (IEEE NEMS 2023)-
dc.identifier.urihttp://hdl.handle.net/10203/316381-
dc.languageEnglish-
dc.publisherIEEE-NEMS(nano/micro engineering molecular system)-
dc.titleSilicon Wafer’s Non-destructive Measurement System based on Optical Third Harmonic Generation (THG)-
dc.typeConference-
dc.type.rimsCONF-
dc.citation.publicationnameThe 18th IEEE International Conference on Nano/Micro Engineered and Molecular Systems (IEEE NEMS 2023)-
dc.identifier.conferencecountryKO-
dc.identifier.conferencelocationRamada Plaza Hotel Jeju-
dc.contributor.localauthorKIM, Young-Jin-
dc.contributor.nonIdAuthorLee, In Jae-
dc.contributor.nonIdAuthorKim, Dae Hee-
dc.contributor.nonIdAuthorHahm, Jiwon-
dc.contributor.nonIdAuthorKim, Seung-Woo-
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ME-Conference Papers(학술회의논문)
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