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College of Engineering(공과대학)School of Electrical Engineering(전기및전자공학부)EE-Conference Papers(학술회의논문)

Monolithic 3D 집적 공정에서의 ILD 두께에 따른 열 분포 분석

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정재중 / 박영근 / 백용구 / 김희태 / 김동빈 / 조병진researcher
Publisher
SK하이닉스, 한국반도체산업협회, 한국반도체연구조합
Issue Date
2023-02-14
Language
Korean
Citation

제 30회 한국반도체학술대회

URI
http://hdl.handle.net/10203/314994
Appears in Collection
EE-Conference Papers(학술회의논문)
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