Anisotropic conductive adhesives for thermo-compression bonding containing solder conductive particles and flux additives and method of connecting electronic parts using the same솔더 도전 입자와 플럭스 첨가제를 함유하는 열압착 접합용 이방성 전도성 접착제 및 이를 이용한 전자부품 간 접속방법
Disclosed are an anisotropic conductive adhesives for thermo-compression bonding containing solder conductive particles and flux additives and a method of connecting electronic parts using the same. The anisotropic conductive adhesives for thermo-compression bonding may include a flux activator, solder particles and polymer resin.
- Assignee
- KAIST
- Country
- US (United States)
- Application Date
- 2020-11-18
- Application Number
- 16951466
- Registration Date
- 2023-08-22
- Registration Number
- 11732162
- Appears in Collection
- MS-Patent(특허)
- Files in This Item
- There are no files associated with this item.
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