DC Field | Value | Language |
---|---|---|
dc.contributor.author | Park, Juseong | ko |
dc.contributor.author | Kim, Sanha | ko |
dc.contributor.author | Kang Sukkyung | ko |
dc.contributor.author | Kim, Kyung Min | ko |
dc.date.accessioned | 2023-02-01T03:01:48Z | - |
dc.date.available | 2023-02-01T03:01:48Z | - |
dc.date.created | 2023-01-10 | - |
dc.date.issued | 2022-11-06 | - |
dc.identifier.citation | Electronic Materials and Nanotechnology for Green Environment (ENGE) 2022 | - |
dc.identifier.uri | http://hdl.handle.net/10203/304916 | - |
dc.language | English | - |
dc.publisher | The Korean Institute of Metals and Materials | - |
dc.title | Polymer/Cu hybrid CMP process for high-reliability of Cu direct bonding | - |
dc.type | Conference | - |
dc.type.rims | CONF | - |
dc.citation.publicationname | Electronic Materials and Nanotechnology for Green Environment (ENGE) 2022 | - |
dc.identifier.conferencecountry | KO | - |
dc.identifier.conferencelocation | Ramada Plaza Hotel Jeju & Online | - |
dc.contributor.localauthor | Kim, Sanha | - |
dc.contributor.nonIdAuthor | Park, Juseong | - |
dc.contributor.nonIdAuthor | Kim, Kyung Min | - |
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