DC Field | Value | Language |
---|---|---|
dc.contributor.author | Ryu, Hyun Jun | ko |
dc.contributor.author | Kim, Sanha | ko |
dc.contributor.author | Jeong, Ji-hun | ko |
dc.contributor.author | Kim, Dong Geun | ko |
dc.date.accessioned | 2023-01-31T06:01:49Z | - |
dc.date.available | 2023-01-31T06:01:49Z | - |
dc.date.created | 2023-01-10 | - |
dc.date.issued | 2022-10-28 | - |
dc.identifier.citation | International Conference on Planarization Technology, ICPT 2022 | - |
dc.identifier.uri | http://hdl.handle.net/10203/304833 | - |
dc.language | English | - |
dc.publisher | ICPT | - |
dc.title | Evaluation of Polishing Performance by CMP Pad with Bi-layered Asperities | - |
dc.type | Conference | - |
dc.type.rims | CONF | - |
dc.citation.publicationname | International Conference on Planarization Technology, ICPT 2022 | - |
dc.identifier.conferencecountry | US | - |
dc.identifier.conferencelocation | The Benson Hotel, Portland, OR | - |
dc.contributor.localauthor | Kim, Sanha | - |
dc.contributor.nonIdAuthor | Jeong, Ji-hun | - |
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