DC Field | Value | Language |
---|---|---|
dc.contributor.author | Kim, Kyuyoung | ko |
dc.contributor.author | Choi, Jungrak | ko |
dc.contributor.author | Jeong, Yongrok | ko |
dc.contributor.author | Kim, Min Seong | ko |
dc.contributor.author | Park, Jaeho | ko |
dc.contributor.author | OH, Yong Suk | ko |
dc.contributor.author | Park, Inkyu | ko |
dc.date.accessioned | 2021-12-15T06:50:16Z | - |
dc.date.available | 2021-12-15T06:50:16Z | - |
dc.date.created | 2021-12-02 | - |
dc.date.created | 2021-12-02 | - |
dc.date.issued | 2019-01-29 | - |
dc.identifier.citation | 32nd IEEE International Conference on Micro Electro Mechanical System, MEMS 2019, pp.835 - 855 | - |
dc.identifier.issn | 1084-6999 | - |
dc.identifier.uri | http://hdl.handle.net/10203/290702 | - |
dc.description.abstract | In this research, we introduce a wearable soft microfluidic pressure sensor using 3D-printed microbumps and liquid metal and its potential applications in health monitoring. Our pressure sensor fabricated with elastomer and liquid metal which provide stretchability has an enhanced sensitivity (0.3 kPa-1@100kPa) compared to other reported microfluidic pressure sensors [1] and a good recovery characteristic in pressure range to 100 kPa. It has an enough sensitivity to be applied in pressure monitoring applications. Blood pressure could be estimated through monitoring pulse rate and electrocardiogram (ECG) data simultaneously. Also, human body pressure distribution was monitored using multiple pressure sensors attached on the clothes when lying on the bed. Biosignals and human body pressure data achieved through the proposed pressure sensor would be applied to early diagnosis and prevention of diseases such as diabetes and bedsores. | - |
dc.language | English | - |
dc.publisher | IEEE | - |
dc.title | WEARABLE SOFT MICROFLUIDIC PRESSURE SENSOR USING 3D-PRINTED MICROBUMP FOR HEALTH MONITORING | - |
dc.type | Conference | - |
dc.identifier.wosid | 000541142100234 | - |
dc.identifier.scopusid | 2-s2.0-85074369068 | - |
dc.type.rims | CONF | - |
dc.citation.beginningpage | 835 | - |
dc.citation.endingpage | 855 | - |
dc.citation.publicationname | 32nd IEEE International Conference on Micro Electro Mechanical System, MEMS 2019 | - |
dc.identifier.conferencecountry | KO | - |
dc.identifier.conferencelocation | COEX, Seoul | - |
dc.identifier.doi | 10.1109/MEMSYS.2019.8870758 | - |
dc.contributor.localauthor | Park, Inkyu | - |
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