학위논문(박사) - 한국과학기술원 : 전기및전자공학부, 2019.8,[iv, 52 p. :]
Through Silicon Via (TSV)▼a2.5D/3D IC▼a3D TLM▼anoise coupling▼aactive circuit▼ashielding▼aVCO▼aphase noise; 실리콘관통비아▼a2.5/3차원 집적회로▼a잡음 전달▼a능동 회로▼a차폐▼a전압제어 발신기▼a위상 잡음
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