Effects of polyvinylidene difluoride (PVDF) anchoring polymer layer (APL) solder anisotropic conductive films (ACFs) on fine pitch flex-on-flex (FOF) assembly using a thermo-compression bonding method열압착 공정을 이용한 고정용 폴리비닐리덴 플루오라이드 폴리머 층을 지닌 솔더 이방성 전도 필름의 미세피치 flex-on-flex 어플리케이션에 대한 연구

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Nowadays, the trends in electronic products requiring high capability, flexibility and I/O density, fine pitch Flex-on-Flex assembly was introduced into packaging area. In this paper, the effects of Polyvinylidene Difluoride (PVDF) Anchoring polymer layer (APL) solder ACFs on fine pitch Flex-on-Flex was investigated. The capture rates and insulation rates have been improved by using PVDF APL ACFs due to the high tensile strength of PVDF layer, the function can be obtained by the ultimate tensile strength (UTS) equipment and optical microscope. According to the results, the capture rates increase as the tensile strength of PVDF increased. In addition, the tensile strength of PVDF layer decreased as the flux activators content in APL increased. Furthermore, after the pressure cooker test (PCT) and 85 $^\circ C$/ 85% (RH) test, the optimized flux activators content in ACFs with 0.5 wt. % in APL and 2 wt. % in NCFs and optimized heating rates showed stability in contact resistance. The PVDF APL solder ACF assembly can be used into the small dimension and high capability electronic products packaging area.
Advisors
Paik, Kyoung Wookresearcher백경욱researcher
Description
한국과학기술원 :신소재공학과,
Publisher
한국과학기술원
Issue Date
2019
Identifier
325007
Language
eng
Description

학위논문(석사) - 한국과학기술원 : 신소재공학과, 2019.8,[vi, 49 p. :]

Keywords

ACFs▼aelectronic packaging▼atensile strength▼afine pitch▼aAPL; 이방성 전도 필름▼a전자패키징▼a인장 강도▼a미세피치▼a사용한 고정용 폴리머 층

URI
http://hdl.handle.net/10203/283011
Link
http://library.kaist.ac.kr/search/detail/view.do?bibCtrlNo=875305&flag=dissertation
Appears in Collection
MS-Theses_Master(석사논문)
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