전자기파 신호를 전송하기 위한 도파관 및 이를 포함하는 칩-대-칩 인터페이스 장치Power and electrical signal transfering method through a metal cladding of a polymer waveguide
- Assignee
- 한국과학기술원
- Country
- CH (Switzerland)
- Application Date
- 2017-03-28
- Application Number
- 106110295
- Registration Date
- 2020-04-01
- Registration Number
- I690114
- Appears in Collection
- EE-Patent(특허)
- Files in This Item
- There are no files associated with this item.
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