DC Field | Value | Language |
---|---|---|
dc.contributor.author | 배현민 | ko |
dc.contributor.author | 송하일 | ko |
dc.contributor.author | 이준영 | ko |
dc.contributor.author | 윤태훈 | ko |
dc.contributor.author | 원효섭 | ko |
dc.date.accessioned | 2020-07-03T07:20:36Z | - |
dc.date.available | 2020-07-03T07:20:36Z | - |
dc.identifier.uri | http://hdl.handle.net/10203/275211 | - |
dc.title | 전자기파 신호를 전송하기 위한 도파관 및 이를 포함하는 칩-대-칩 인터페이스 장치 | - |
dc.title.alternative | Power and electrical signal transfering method through a metal cladding of a polymer waveguide | - |
dc.type | Patent | - |
dc.type.rims | PAT | - |
dc.contributor.localauthor | 배현민 | - |
dc.contributor.nonIdAuthor | 송하일 | - |
dc.contributor.nonIdAuthor | 이준영 | - |
dc.contributor.assignee | 한국과학기술원 | - |
dc.identifier.iprsType | 특허 | - |
dc.identifier.patentApplicationNumber | 106110295 | - |
dc.identifier.patentRegistrationNumber | I690114 | - |
dc.date.application | 2017-03-28 | - |
dc.date.registration | 2020-04-01 | - |
dc.publisher.country | CH | - |
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