Strategies for Mechanically Reliable Thin-Film Flexible Electronics
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Kim, Taek-Soo | ko |
| dc.date.accessioned | 2020-01-11T08:20:24Z | - |
| dc.date.available | 2020-01-11T08:20:24Z | - |
| dc.date.created | 2019-12-20 | - |
| dc.date.issued | 2019-10-24 | - |
| dc.identifier.citation | International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) | - |
| dc.identifier.uri | http://hdl.handle.net/10203/271081 | - |
| dc.language | English | - |
| dc.publisher | IEEE EPS-Taipei, iMAPS-Taiwan, ITRI and TPCA | - |
| dc.title | Strategies for Mechanically Reliable Thin-Film Flexible Electronics | - |
| dc.type | Conference | - |
| dc.type.rims | CONF | - |
| dc.citation.publicationname | International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) | - |
| dc.identifier.conferencecountry | CH | - |
| dc.identifier.conferencelocation | Taipei Nangang Exhibition Center | - |
| dc.contributor.localauthor | Kim, Taek-Soo | - |
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