Integrating 3D Resistive Memory Cache into GPGPU for Energy-Efficient Data Processing

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General purpose graphics processing units (GPUs) have become a promising solution to process massive data by taking advantages of multithreading. Thanks to thread-level parallelism, GPU-accelerated applications improve the overall system performance by up to 40 times [1], [2], compared to CPU-only architecture. However, data-intensive GPU applications often generate large amount of irregular data accesses, which results in cache thrashing and contention problems [11], [12]. The cache thrashing in turn can introduce a large number of off-chip memory accesses, which not only wastes tremendous energy to move data around on-chip cache and off-chip global memory, but also significantly limits system performance due to many stalled load/store instructions [18], [21].In this work, we redesign the shared last-level cache (LLC) of GPU devices by introducing non-volatile memory (NVM), which can address the cache thrashing issues with low energy consumption. Specifically, we investigate two architectural approaches, one of each employs a 2D planar resistive random-access memory (RRAM) as our baseline NVM-cache and a 3D-stacked RRAM technology [14], [15]. Our baseline NVM-cache replaces the SRAM-based L2 cache with RRAM of similar area size; a memory die consists of eight subarrays, one of which a small fraction of memristor island by constructing 512x512 matrix [13]. Since the feature size of SRAM is around 125 F2 [19] (while that of RRAM around 4 F2 [20]), it can offer around 30x bigger storage capacity than the SRAM-based cache. To make our baseline NVM-cache denser, we proposed 3D-stacked NVM-cache, which piles up four memory layers, and each of them has a single pre-decode logic [16], [17].
Publisher
ACM and IEEE Computer Society
Issue Date
2015-10-18
Language
English
Citation

24th International Conference on Parallel Architecture and Compilation, PACT 2015, pp.496 - 497

DOI
10.1109/PACT.2015.60
URI
http://hdl.handle.net/10203/269653
Appears in Collection
EE-Conference Papers(학술회의논문)
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