Integrating 3D Resistive Memory Cache into GPGPU for Energy-Efficient Data Processing

Cited 1 time in webofscience Cited 2 time in scopus
  • Hit : 181
  • Download : 0
DC FieldValueLanguage
dc.contributor.authorZhang, Jieko
dc.contributor.authorDonofrio, Davidko
dc.contributor.authorShalf, Johnko
dc.contributor.authorJung, Myoungsooko
dc.date.accessioned2019-12-13T13:26:57Z-
dc.date.available2019-12-13T13:26:57Z-
dc.date.created2019-11-28-
dc.date.created2019-11-28-
dc.date.created2019-11-28-
dc.date.issued2015-10-18-
dc.identifier.citation24th International Conference on Parallel Architecture and Compilation, PACT 2015, pp.496 - 497-
dc.identifier.urihttp://hdl.handle.net/10203/269653-
dc.description.abstractGeneral purpose graphics processing units (GPUs) have become a promising solution to process massive data by taking advantages of multithreading. Thanks to thread-level parallelism, GPU-accelerated applications improve the overall system performance by up to 40 times [1], [2], compared to CPU-only architecture. However, data-intensive GPU applications often generate large amount of irregular data accesses, which results in cache thrashing and contention problems [11], [12]. The cache thrashing in turn can introduce a large number of off-chip memory accesses, which not only wastes tremendous energy to move data around on-chip cache and off-chip global memory, but also significantly limits system performance due to many stalled load/store instructions [18], [21].In this work, we redesign the shared last-level cache (LLC) of GPU devices by introducing non-volatile memory (NVM), which can address the cache thrashing issues with low energy consumption. Specifically, we investigate two architectural approaches, one of each employs a 2D planar resistive random-access memory (RRAM) as our baseline NVM-cache and a 3D-stacked RRAM technology [14], [15]. Our baseline NVM-cache replaces the SRAM-based L2 cache with RRAM of similar area size; a memory die consists of eight subarrays, one of which a small fraction of memristor island by constructing 512x512 matrix [13]. Since the feature size of SRAM is around 125 F2 [19] (while that of RRAM around 4 F2 [20]), it can offer around 30x bigger storage capacity than the SRAM-based cache. To make our baseline NVM-cache denser, we proposed 3D-stacked NVM-cache, which piles up four memory layers, and each of them has a single pre-decode logic [16], [17].-
dc.languageEnglish-
dc.publisherACM and IEEE Computer Society-
dc.titleIntegrating 3D Resistive Memory Cache into GPGPU for Energy-Efficient Data Processing-
dc.typeConference-
dc.identifier.wosid000378942700049-
dc.identifier.scopusid2-s2.0-84975453886-
dc.type.rimsCONF-
dc.citation.beginningpage496-
dc.citation.endingpage497-
dc.citation.publicationname24th International Conference on Parallel Architecture and Compilation, PACT 2015-
dc.identifier.conferencecountryUS-
dc.identifier.conferencelocationThe Sir Francis Drake Hotel-
dc.identifier.doi10.1109/PACT.2015.60-
dc.contributor.localauthorJung, Myoungsoo-
dc.contributor.nonIdAuthorZhang, Jie-
dc.contributor.nonIdAuthorDonofrio, David-
dc.contributor.nonIdAuthorShalf, John-
Appears in Collection
EE-Conference Papers(학술회의논문)
Files in This Item
There are no files associated with this item.
This item is cited by other documents in WoS
⊙ Detail Information in WoSⓡ Click to see webofscience_button
⊙ Cited 1 items in WoS Click to see citing articles in records_button

qr_code

  • mendeley

    citeulike


rss_1.0 rss_2.0 atom_1.0