학위논문(석사) - 한국과학기술원 : 신소재공학과, 2018.2,[52 p. :]
Semiconductor Packaging▼aFan-Out Panel-Level packages (FOPLPs)▼aEpoxy Molding Compound (EMC)▼aEpoxy Molding Films (EMFs); 반도체 패키징▼a팬아웃패널레벨패키징▼a에폭시몰딩컴파운드▼a에폭시몰딩필름
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