Thermal Assisted UV-Ozone Treatment to Improve Reliability of Ag Nanoparticle Thin Films
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Lee, I. | ko |
| dc.contributor.author | Lee, J. | ko |
| dc.contributor.author | Ko, Seung Hwan | ko |
| dc.contributor.author | Kim, Taek-Soo | ko |
| dc.date.accessioned | 2019-04-15T18:30:19Z | - |
| dc.date.available | 2019-04-15T18:30:19Z | - |
| dc.date.created | 2014-01-14 | - |
| dc.date.issued | 2013-10-06 | - |
| dc.identifier.citation | 15th International Conference on Electronic Materials and Packaging | - |
| dc.identifier.uri | http://hdl.handle.net/10203/257164 | - |
| dc.language | English | - |
| dc.publisher | Electronic Materials and Packaging (EMAP) | - |
| dc.title | Thermal Assisted UV-Ozone Treatment to Improve Reliability of Ag Nanoparticle Thin Films | - |
| dc.type | Conference | - |
| dc.type.rims | CONF | - |
| dc.citation.publicationname | 15th International Conference on Electronic Materials and Packaging | - |
| dc.identifier.conferencecountry | KO | - |
| dc.contributor.localauthor | Ko, Seung Hwan | - |
| dc.contributor.localauthor | Kim, Taek-Soo | - |
| dc.contributor.nonIdAuthor | Lee, I. | - |
| dc.contributor.nonIdAuthor | Lee, J. | - |
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