DSpace at KOASAS: 3D TSV Vertical Interconnection Using NCF Materials

DSpace at KOASAS

College of Engineering(공과대학)Dept. of Materials Science and Engineering(신소재공학과)MS-Conference Papers(학술회의논문)

3D TSV Vertical Interconnection Using NCF Materials

Cited 0 time in webofscience

Cited 0 time in scopus

Hit : 269
Download : 0

Export

Paik, Kyung-Wook researcher / Choi,Yong-Woon / Shin , Ji-Won

Publisher: 2014 Pan Pacific Microelectronics Symposium

Issue Date: 2014-02-11

Language: English

Citation: 2014 Pan Pacific Microelectronics Symposium

URI: http://hdl.handle.net/10203/255469

Appears in Collection: MS-Conference Papers(학술회의논문)

Files in This Item: There are no files associated with this item.

Display Full Item Record

qr_code

트윗하기

KOASAS

Knowledge Service Development Team, KAIST 291 Daehak-ro, Yuseong-gu, Daejeon 34141, Republic of Korea. T. 82-42-350-4493 Email. koasas@kaist.ac.kr
Copyright © 2016. Korea Advanced Institute of Science and Technology. All Rights Reserved.

KOASAS

KOASAS

Browse

3D TSV Vertical Interconnection Using NCF Materials

KOASAS

Communities & Collections