DC Field | Value | Language |
---|---|---|
dc.contributor.author | 김철규 | ko |
dc.contributor.author | 이태익 | ko |
dc.contributor.author | 김민성 | ko |
dc.contributor.author | 김택수 | ko |
dc.date.accessioned | 2019-04-15T15:54:57Z | - |
dc.date.available | 2019-04-15T15:54:57Z | - |
dc.date.created | 2014-06-25 | - |
dc.date.issued | 2014-02-26 | - |
dc.identifier.citation | 2014 KSME Spring Meeting | - |
dc.identifier.uri | http://hdl.handle.net/10203/255438 | - |
dc.language | Korean | - |
dc.publisher | KSME | - |
dc.title | Methodology Development of Warpage Analysis of Packaging Substrate | - |
dc.type | Conference | - |
dc.type.rims | CONF | - |
dc.citation.publicationname | 2014 KSME Spring Meeting | - |
dc.identifier.conferencecountry | KO | - |
dc.contributor.localauthor | 김택수 | - |
dc.contributor.nonIdAuthor | 김철규 | - |
dc.contributor.nonIdAuthor | 이태익 | - |
dc.contributor.nonIdAuthor | 김민성 | - |
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