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Results 91-98 of 98 (Search time: 0.007 seconds).
| NO | Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date) |
|---|---|
| A 5.9 GHz Channel Characterization at Railroad Crossings for Train-to-Infrastructure (T2I) Communications Choi, Junsung; Ahn, Seungyoung, ELECTRONICS, v.12, no.11, 2023-05 | |
| A Novel Interposer Channel Structure with Vertical Tabbed Vias to Reduce Far-End Crosstalk for Next-Generation High-Bandwidth Memory Kim, Hyunwoong; Lee, Seonghi; Song, Kyunghwan; Shin, Yujun; Park, Dongyrul; Park, Jongcheol; Cho, Jaeyong; Ahn, Seungyoung, MICROMACHINES, v.13, no.7, 2022-07 | |
| Wireless Power Transfer-Based Microrobot with Magnetic Force Propulsion Considering Power Transfer Efficiency Kim, Dongwook; Ahn, Seungyoung, JOURNAL OF ELECTROMAGNETIC ENGINEERING AND SCIENCE, v.22, no.4, pp.488 - 495, 2022-07 | |
| Determination of Compensation Capacitor Considering the Dead-Time Characteristics for ZVS in Wireless Power Transfer System Kim, Haerim; Kim, Jongwook; Ahn, Jangyong; Shin, Yujun; Park, Bumjin; Huh, Sungryul; Choi, Semin; Park, Jaehyoung; Ahn, Seungyoung, IEEE JOURNAL OF EMERGING AND SELECTED TOPICS IN POWER ELECTRONICS, v.11, no.3, pp.2501 - 2513, 2023-06 | |
| Signal Integrity Analysis of Through-Silicon Via (TSV) With a Silicon Dioxide Well to Reduce Leakage Current for High-Bandwidth Memory Interface Kim, Hyunwoong; Lee, Seonghi; Park, Jongcheol; Shin, Yujun; Woo, Seongho; Kim, Jongwook; Cho, Jaeyong; Ahn, Seungyoung, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.13, no.5, pp.700 - 714, 2023-05 | |
| Design and Analysis of a Magnetic Field Communication System Using a Giant Magneto-Impedance Sensor Ryu, Seunghun; Kim, Kibeom; Kim, Jang-Yeol; Cho, In-Kui; Kim, Haerim; Ahn, Jangyong; Choi, Junsung; Ahn, Seungyoung, IEEE ACCESS, v.10, pp.56961 - 56973, 2022-05 | |
| Transmitter Coils Selection Method for Wireless Power Transfer System with Multiple Transmitter Coils and Single Receiver Coil Huh, Sungryul; Park, Bumjin; Choi, Semin; Shin, Yujun; Kim, Haerim; Kim, Jongwook; Park, Jaehyoung; Park, Dongryul; Ahn, Seungyoung, IEEE TRANSACTIONS ON POWER ELECTRONICS, v.38, no.3, pp.4092 - 4109, 2023-03 | |
| Signal Integrity Analysis of Through-Silicon-Via (TSV) with Passive Equalizer to Separate Return Path and Mitigate the Inter-Symbol Interference (ISI) for Next Generation High Bandwidth Memory Kim, HyunWoong; Park, Jongcheol; Lee, Sanguk; Kim, Jongwook; Ahn, Seungyoung, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.13, no.12, pp.1973 - 1988, 2023-12 |
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