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| NO | Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date) |
|---|---|
Design Considerations for Adding Series Inductors to Reduce Electromagnetic Field Interference in an Over-Coupled WPT System Shin, Yujun; Park, Jaehyoung; Kim, Haerim; Woo, Seongho; Park, Bumjin; Huh, Sungryul; Lee, Changmin; Ahn, Seungyoung, ENERGIES, v.14, no.10, 2021-05 | |
| The Magnetic Energy Harvester With Improved Power Density Using Saturable Magnetizing Inductance Model for Maintenance Applications Near High Voltage Power Line Park, Bumjin; Huh, Sungryul; Kim, Jongwook; Kim, Haerim; Shin, Yujun; Woo, Seongho; Park, Jaehyoung; Brito, Andres; Kim, Dongwook; Park, Hyun Ho; Jeong, Okhyun; Koo, Ja-Il; Ahn, Seungyoung, IEEE ACCESS, v.9, pp.82661 - 82674, 2021 | |
| Wireless torque and power transfer using multiple coils with LCC-S topology for implantable medical drug pump Rhee, Jaewon; Shin, Yujun; Woo, Seongho; Lee, Changmin; Kim, Dongwook; Ahn, Jangyong; Kim, Haerim; Ahn, Seungyoung, SENSORS, v.21, no.23, 2021-12 | |
| Minimizing Leakage Magnetic Field of Wireless Power Transfer Systems Using Phase Difference Control Woo, Seongho; Shin, Yujun; Lee, Changmin; Rhee, Jaewon; Ahn, Jangyong; Moon, Jungick; Son, Seokhyeon; Lee, Sanguk; Kim, Hongseok; Ahn, Seungyoung, ENERGIES, v.15, no.21, 2022-11 | |
| Design of a Wireless Power Transfer System With Two Inputs With Large Voltage Differences for Missiles Mounted on Maritime Vessels Shin, Yujun; Woo, Seongho; Lee, Changmin; Jeong, Jaiwoong; Kwak, Gyumin; Ahn, Seungyoung, IEEE ACCESS, v.10, pp.70825 - 70839, 2022-06 | |
| Accurate Method for Extracting the Coupling Coefficient of an LCC-Series Wireless Power Transfer System Shin, Yujun; Woo, Seongho; Rhee, Jaewon; Lee, Changmin; Kim, Haerim; Huh, Sungryul; Park, Bumjin; Ahn, Seungyoung, IEEE TRANSACTIONS ON POWER ELECTRONICS, v.37, no.9, pp.11406 - 11422, 2022-09 | |
| Sensor Coil System for Misalignment Detection and Information Transfer in Dynamic Wireless Power Transfer of Electric Vehicle Son, Seokhyeon; Shin, Yujun; Woo, Seongho; Ahn, Seungyoung, JOURNAL OF ELECTROMAGNETIC ENGINEERING AND SCIENCE, v.22, no.3, pp.309 - 318, 2022-05 | |
| Signal Integrity Analysis of Through-Silicon Via (TSV) With a Silicon Dioxide Well to Reduce Leakage Current for High-Bandwidth Memory Interface Kim, Hyunwoong; Lee, Seonghi; Park, Jongcheol; Shin, Yujun; Woo, Seongho; Kim, Jongwook; Cho, Jaeyong; Ahn, Seungyoung, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.13, no.5, pp.700 - 714, 2023-05 |
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