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Showing results 1 to 6 of 6

1
A Novel Interposer Channel Structure with Vertical Tabbed Vias to Reduce Far-End Crosstalk for Next-Generation High-Bandwidth Memory

Kim, Hyunwoong; Lee, Seonghi; Song, Kyunghwan; Shin, Yujun; Park, Dongyrul; Park, Jongcheol; Cho, Jaeyong; et al, MICROMACHINES, v.13, no.7, 2022-07

2
Analysis of Methodology of Breakpoint Detection Method for 22.9kV Submarine Power cable based on the Time Domain Reflectometer (TDR)

Kim, Hyunwoong; Lee, Sanguk; Joung, Jong-Man; Park, Bumjin; Ahn, Seungyoung, 2023 IEEE Symposium on Electromagnetic Compatibility and Signal/Power Integrity, EMC+SIPI 2023, pp.191 - 195, Institute of Electrical and Electronics Engineers Inc., 2023-08

3
Modeling, Verification, and Signal Integrity Analysis of High-Speed Signaling Channel with Tabbed Routing in High Performance Computing Server Board

Song, Kyunghwan; Kim, Jongwook; Kim, Hyunwoong; Lee, Seonghi; Ahn, Jangyong; Brito, Andres; Kim, Hyunsik; et al, ELECTRONICS, v.10, no.13, 2021-07

4
Proposal of Electromagnetic Pulse (EMP) Coupling Estimation Method to Power System including Load condition and Surge Protection Device (SPD)

Kim, Hyunwoong; Kim, Kibeom; Song, Kyunghwan; Park, Yoon-Mi; Ryu, Seung-Kab; Ahn, Seungyoung, IEEE International Symposium on Electromagnetic Compatibility and Signal/Power Integrity, EMCSI 2020, Institute of Electrical and Electronics Engineers Inc., 2020-08

5
Resonant Frequency Selection Method for Wireless Power Transfer System Considering Electromagnetic Interference Reduction

Park, Jaehyoung; Shin, Yujun; Kim, Jongwook; Park, Bumjin; Kim, Hyunwoong; Ahn, Seungyoung, 2019 IEEE International Symposium on Electromagnetic Compatibility, Signal and Power Integrity, EMC+SIPI 2019, pp.635 - 638, Institute of Electrical and Electronics Engineers Inc., 2019-07

6
Signal Integrity Analysis of Through-Silicon Via (TSV) With a Silicon Dioxide Well to Reduce Leakage Current for High-Bandwidth Memory Interface

Kim, Hyunwoong; Lee, Seonghi; Park, Jongcheol; Shin, Yujun; Woo, Seongho; Kim, Jongwook; Cho, Jaeyong; et al, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.13, no.5, pp.700 - 714, 2023-05

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