Showing results 3 to 7 of 7
Modeling, Verification, and Signal Integrity Analysis of High-Speed Signaling Channel with Tabbed Routing in High Performance Computing Server Board![]() Song, Kyunghwan; Kim, Jongwook; Kim, Hyunwoong; Lee, Seonghi; Ahn, Jangyong; Brito, Andres; Kim, Hyunsik; et al, ELECTRONICS, v.10, no.13, 2021-07 |
Proposal of Electromagnetic Pulse (EMP) Coupling Estimation Method to Power System including Load condition and Surge Protection Device (SPD) Kim, Hyunwoong; Kim, Kibeom; Song, Kyunghwan; Park, Yoon-Mi; Ryu, Seung-Kab; Ahn, Seungyoung, IEEE International Symposium on Electromagnetic Compatibility and Signal/Power Integrity, EMCSI 2020, Institute of Electrical and Electronics Engineers Inc., 2020-08 |
Resonant Frequency Selection Method for Wireless Power Transfer System Considering Electromagnetic Interference Reduction Park, Jaehyoung; Shin, Yujun; Kim, Jongwook; Park, Bumjin; Kim, Hyunwoong; Ahn, Seungyoung, 2019 IEEE International Symposium on Electromagnetic Compatibility, Signal and Power Integrity, EMC+SIPI 2019, pp.635 - 638, Institute of Electrical and Electronics Engineers Inc., 2019-07 |
Signal Integrity Analysis of Through-Silicon Via (TSV) With a Silicon Dioxide Well to Reduce Leakage Current for High-Bandwidth Memory Interface Kim, Hyunwoong; Lee, Seonghi; Park, Jongcheol; Shin, Yujun; Woo, Seongho; Kim, Jongwook; Cho, Jaeyong; et al, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.13, no.5, pp.700 - 714, 2023-05 |
Signal integrity analysis, design, and modeling of high speed and low power Through-Silicon Via (TSV) enablers for next-generation High-Bandwidth Memory (HBM) = 차세대 고대역폭 메모리를 위한 고속 및 저전력 실리콘 관통 전극 인에이블러의 신호 무결성 분석, 설계 및 모델링link Kim, Hyunwoong; 김현웅; et al, 한국과학기술원, 2024 |
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