Characteristics of particulate generated by dry laser stripping of positive photoresist on glass wafer

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dc.contributor.author김, 진호-
dc.contributor.author김, 상수-
dc.date.accessioned2011-10-25T04:48:47Z-
dc.date.available2011-10-25T04:48:47Z-
dc.date.issued2005-07-
dc.identifier.citation한국입자에어로졸학회 학술대회 논문집, pp.291-292en
dc.identifier.urihttp://hdl.handle.net/10203/25462-
dc.description.abstractThe characteristics of particles during the stripping of photoresist by ns-pulsed UV laser were investigated. For optically transparent substrate like glass wafer, laser irradiation from backside of wafer was more effective for the photoresist stripping than that from front-side of wafer. The difference between irradiation directions was caused by the enhancement of mechanical effect in backward laser irradiation.en
dc.description.sponsorshipThis work was supported by the Korea ministry of education for Brain Korea 21 program.en
dc.language.isoen_USen
dc.publisher한국입자에어로졸학회en
dc.subjectpulsed laseren
dc.subjectdry strippingen
dc.subjectphotoresisten
dc.subjectnanoparticleen
dc.titleCharacteristics of particulate generated by dry laser stripping of positive photoresist on glass waferen
dc.typeArticleen

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