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Browse "EE-Theses_Master(석사논문) " by Subject Embedded Cooling Structure▼aFluidic Through Silicon Via▼aHigh Bandwidth Memory Module▼aSignal Integrity▼aThermal integrity▼aThermal Transmission Line

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Thermal transmission line (TTL) and fluidic through silicon via (F-TSV) based embedded cooling structure for high bandwidth memory (HBM) module considering signal and thermal integrity (STI) = 신호 무결성 및 열 무결성을 고려한 고대역폭 메모리 모듈을 위한 열 전송 선로와 유체 흐름용 실리콘 관통 비아 기반 내장형 냉각 구조 설계link

Son, Keeyoung; Kim, Joungho; et al, 한국과학기술원, 2021

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