The effect of through-the-thickness holes on a reference-free damage diagnosis technique
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Lee, C. | ko |
| dc.contributor.author | Kim, S. | ko |
| dc.contributor.author | Sohn, Hoon | ko |
| dc.date.accessioned | 2011-08-12T01:51:48Z | - |
| dc.date.available | 2011-08-12T01:51:48Z | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.issued | 2008-03-10 | - |
| dc.identifier.citation | Sensors and Smart Structures Technologies for Civil, Mechanical, and Aerospace Systems 2008 | - |
| dc.identifier.uri | http://hdl.handle.net/10203/24871 | - |
| dc.description.sponsorship | This work was supported by the Smart Infra-Structure Technology Center (SISTeC) at KAIST, Korea Science and Engineering Foundation (KOSEF, M20703000015-07N0300-01510) and Korea Research Foundation (KRF, D00032). The authors like to acknowledge those foundations and center, sincerely. | en |
| dc.language | English | - |
| dc.language.iso | en_US | en |
| dc.publisher | SPIE | - |
| dc.title | The effect of through-the-thickness holes on a reference-free damage diagnosis technique | - |
| dc.type | Conference | - |
| dc.identifier.wosid | 000257062100052 | - |
| dc.identifier.scopusid | 2-s2.0-44349165162 | - |
| dc.type.rims | CONF | - |
| dc.citation.publicationname | Sensors and Smart Structures Technologies for Civil, Mechanical, and Aerospace Systems 2008 | - |
| dc.identifier.conferencecountry | US | - |
| dc.identifier.conferencelocation | San Diego, CA | - |
| dc.embargo.liftdate | 9999-12-31 | - |
| dc.embargo.terms | 9999-12-31 | - |
| dc.contributor.localauthor | Sohn, Hoon | - |
| dc.contributor.nonIdAuthor | Lee, C. | - |
| dc.contributor.nonIdAuthor | Kim, S. | - |
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