Measurement of Equivalent Modulus of Chip Package Using Bending Test
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Kim, Hyeongjun | ko |
| dc.contributor.author | Lee, Tae-Ik | ko |
| dc.contributor.author | Park, Chun Myung | ko |
| dc.contributor.author | Park, Chang Kyu | ko |
| dc.contributor.author | Kim, Taek-Soo | ko |
| dc.date.accessioned | 2018-12-20T07:28:38Z | - |
| dc.date.available | 2018-12-20T07:28:38Z | - |
| dc.date.created | 2018-12-11 | - |
| dc.date.created | 2018-12-11 | - |
| dc.date.issued | 2018-10-25 | - |
| dc.identifier.citation | The 17th International Symposium on Microelectronics and Packaging (ISMP2018) | - |
| dc.identifier.uri | http://hdl.handle.net/10203/248424 | - |
| dc.language | English | - |
| dc.publisher | The Korean Microelectronics and Packaging Society | - |
| dc.title | Measurement of Equivalent Modulus of Chip Package Using Bending Test | - |
| dc.type | Conference | - |
| dc.type.rims | CONF | - |
| dc.citation.publicationname | The 17th International Symposium on Microelectronics and Packaging (ISMP2018) | - |
| dc.identifier.conferencecountry | KO | - |
| dc.identifier.conferencelocation | COEX, Seoul | - |
| dc.contributor.localauthor | Kim, Taek-Soo | - |
| dc.contributor.nonIdAuthor | Park, Chun Myung | - |
| dc.contributor.nonIdAuthor | Park, Chang Kyu | - |
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