DC Field | Value | Language |
---|---|---|
dc.contributor.author | Sim, Gidong | ko |
dc.contributor.author | Chung, CK | ko |
dc.contributor.author | Paik, KW | ko |
dc.contributor.author | Lee, Soon-Bok | ko |
dc.date.accessioned | 2011-08-04T05:09:46Z | - |
dc.date.available | 2011-08-04T05:09:46Z | - |
dc.date.created | 2012-02-06 | - |
dc.date.created | 2012-02-06 | - |
dc.date.issued | 2009-06-15 | - |
dc.identifier.citation | European Microelectronics and Packaging Conference, EMPC 2009 | - |
dc.identifier.uri | http://hdl.handle.net/10203/24739 | - |
dc.description.sponsorship | This work was financially supported by the Fundamental R&D Program for Core Technology of Materials funded by the Ministry of Knowledge Economy, Republic of Korea. | en |
dc.language | English | - |
dc.language.iso | en_US | en |
dc.publisher | European Microelectronics and Packaging Conference, EMPC 2009 | - |
dc.title | Experimental analysis on the mechanism of moisture induced interface weakening in ACF package | - |
dc.type | Conference | - |
dc.identifier.wosid | 000274631600062 | - |
dc.identifier.scopusid | 2-s2.0-70449817465 | - |
dc.type.rims | CONF | - |
dc.citation.publicationname | European Microelectronics and Packaging Conference, EMPC 2009 | - |
dc.identifier.conferencecountry | IT | - |
dc.identifier.conferencelocation | Rimini | - |
dc.embargo.liftdate | 9999-12-31 | - |
dc.embargo.terms | 9999-12-31 | - |
dc.contributor.localauthor | Sim, Gidong | - |
dc.contributor.localauthor | Lee, Soon-Bok | - |
dc.contributor.nonIdAuthor | Chung, CK | - |
dc.contributor.nonIdAuthor | Paik, KW | - |
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