Strategies for Improving Mechanical Reliability of Thin Film Flexible Electronics
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Kim, Taek-Soo | ko |
| dc.date.accessioned | 2018-07-24T02:30:16Z | - |
| dc.date.available | 2018-07-24T02:30:16Z | - |
| dc.date.created | 2018-07-09 | - |
| dc.date.issued | 2018-04-19 | - |
| dc.identifier.citation | 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference | - |
| dc.identifier.uri | http://hdl.handle.net/10203/244161 | - |
| dc.language | English | - |
| dc.publisher | The Japan Institute of Electronics Packaging | - |
| dc.title | Strategies for Improving Mechanical Reliability of Thin Film Flexible Electronics | - |
| dc.type | Conference | - |
| dc.type.rims | CONF | - |
| dc.citation.publicationname | 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference | - |
| dc.identifier.conferencecountry | JA | - |
| dc.identifier.conferencelocation | Hotel Hanamizuki, Kuwana, Mie | - |
| dc.contributor.localauthor | Kim, Taek-Soo | - |
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