A Study on the Curing properties and Viscosities of Non-Conductive Films (NCFs) for Sn-Ag Solder Bump Flip Chip Assembly
In this study, flip chip assembly using NCFs was evaluated in Sn-Ag solder bump structure. Thermo-Compression (TC) flip chip bonding was performed within 5 seconds using an isothermal TC bonding method. Solder joint morphology was evaluated by adjusting curing properties of NCFs such as curing onset and peak temperature and degree of curing and also viscosities, and the best NCFs properties were optimized. In addition, bonding process conditions were also optimized in terms of solder gap heights and daisy chain electrical resistances. Finally, 85 degrees C/85RH% test and temperature cycling (T/C) reliability test were performed to evaluate the thermo-mechanical and hygroscopic reliability performance of solder joint using NCFs.
- Publisher
- IEEE-CPMT
- Issue Date
- 2018-06-01
- Language
- English
- Citation
68th IEEE Electronic Components and Technology Conference (ECTC), pp.2464 - 2469
- ISSN
- 0569-5503
- Appears in Collection
- MS-Conference Papers(학술회의논문)
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